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apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet specification SSC-SZ5-P series rohs august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 1
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet z-power led x10490 z-power led x10490 technical data sheet z-power led x10490 technical data sheet features applications description the z-power series is designed for high current operation and high flux output applications. it incorporates state of the art smd design and low thermal resistant material. the z power led is ideal light sources for general illuminati on applications, custom designed solutions, large backlight s and high performance torches. ? super high flux output and high luminance ? designed for high current operation ? smt solderable ? lead free product ? rohs compliant ? general torch sz5-p sz5-p series august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 ? architectural lighting ? projector light source ? traffic signals ? task lighting ? decorative / pathway lighting ? remote / solar powered lighting 2
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet contents 1. full code of sz5-p series 2. outline dimensions 3. characteristics of sz5-p0-w0-00 (pure) 4. characteristic diagrams 5. cie chromaticity diagram (pure) 6. bin code description 7. labeling august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 7. labeling 8. packing 9. recommended solder pad 10. soldering 11. precaution for use 12. handling of silicone resin leds 3
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 1. full code of sz5-p series full code form : x 1 x 2 x 3 C x 4 x 5 C x 6 x 7 C x 8 x 9 1. part number x 1 company x 2 z-power led series number x 3 pkg series 2. internal number x 4 pcb type p p series august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 x 5 revision number x 6 x 7 color specification w0 pure white wn neutral white ww warm white x 8 x 9 color specification c8 cri min 80 85 cri min 85 00 the others 4
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 2. outline dimensions august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.1mm 5
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 3. characteristics of sz5-p0-w0-00 (pure) pure white 1-1 electro-optical characteristics at 350ma (ta=25 , rh30%) parameter symbol value unit min typ max luminous flux [1] v [2] - 135 - lm v (tj=100 ) - 120 - correlated color temperature [3] cct - 6000 - k cri [6] r a - 70 - - forward voltage [4] v f - 3.20 - v thermal resistance (j to s) r j-s 5.5 k/w view angle 2 ? 120 deg. 1 - 2 absolute maximum ratings august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 1 - 2 absolute maximum ratings parameter symbol value unit forward current i f 1000 ma 1800 (100ms, 1/10duty) reverse voltage v r 5 v power dissipation p d 4.1 w junction temperature t j 145(@ i f 1000ma) oc operating temperature t opr -40 ~ +85 oc storage temperature t stg -40 ~ +100 oc esd sensitivity(hbm) [5] - 2 kv *notes : [1] ssc maintains a tolerance of 7% on flux and power measurements. [2] v is the total luminous flux output as measured with an integrating sphere. [3] correlated color temperature is derived from th e cie 1931 chromaticity diagram. color coordinate : 0.005, cct 5% tolerance. [4] tolerance is 0.06v on forward voltage measurements [5] a zener diode is included to protect the produc t from esd. [6] tolerance is 2.0 on cri measurements 6
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet color spectrum (if=350ma, ta=25 , rh30%) 4. characteristic diagrams 0.2 0.4 0.6 0.8 1.0 relative output sz5-m0-w0-00 august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 400 450 500 550 600 650 700 750 0.0 wavelength[nm] 7
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet forward current vs. forward voltage, ta=25 forward current characteristics 2.0 2.5 3.0 3.5 4.0 0.0 0.2 0.4 0.6 0.8 1.0 sz5-p0-w0-00 forward current[a] august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 forward current vs. normalized relative luminous fl ux, ta=25 8 0.0 0.2 0.4 0.6 0.8 1.0 0 50 100 150 200 250 300 sz5-p0-w 0-00 relative luminous flux [%] forward current [a] forward voltage[v]
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet forward current vs. chromaticity coordinate, ta=25 forward current characteristics 0.0 0.2 0.4 0.6 0.8 1.0 -0.015 -0.010 -0.005 0.000 0.005 0.010 0.015 chromaticity coordinate shift sz5-p0-w0-00 cie x cie y august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 forward current vs. cct, ta=25 9 forward current [a] 0.0 0.2 0.4 0.6 0.8 1.0 -200 -100 0 100 200 cct shift [k] forward current [a] sz5-p0-w0-00
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 20 40 60 80 100 120 140 0 20 40 60 80 100 relative luminous output[%] junction temperature [ o c ] sz5-p0-w0-00 junction temperature characteristics junction temperature vs. relative light output at i f=350ma august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 20 40 60 80 100 120 140 -1.0 -0.8 -0.6 -0.4 -0.2 0.0 sz5-p0-w0-00 forward voltage shift [v] junction temperature[ o c] junction temperature [ o c ] junction temperature vs. forward voltage at if=350m a 10
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet junction temperature vs. chromaticity coordinate at if=350ma junction temperature characteristics 20 40 60 80 100 120 140 -0.008 -0.006 -0.004 -0.002 0.000 0.002 0.004 sz5-p0-w0-00 cie x cie y chromaticity coordinate shift august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 cct vs. junction temperature at if=350ma 20 40 60 80 100 120 140 -100 0 100 200 300 400 cct shift [k] junction temperature [ o c] sz5-p0-w0-00 20 40 60 80 100 120 140 junction temperature [ o c] 11
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet ambient temperature vs. allowable forward current (tjmax = 145 , @1.0a) characteristic diagrams 0 20 40 60 80 100 120 140 0 200 400 600 800 1000 maximum current [ma] o rj-a=20 o c/w rj-a=15 o c/w rj-a=10 o c/w august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 radiation pattern at 350ma 12 ambient temperature [ o c] -80 -60 -40 -20 0 0.0 0.2 0.4 0.6 0.8 1.0 relative luminous flux angle [deg] 0 30 60 90
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet [ta = 25 if = 350ma] 5. cie chromaticity diagram (pure) august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 13
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 6. bin code description luminous flux (lm) @ i f = 350ma bin code min. max. u3 109 118.5 bin code luminous flux (lm) @ i f = 350ma color chromaticity coordinate @ i f = 350ma forward voltage (v) @ i f = 350ma v2 b3 h forward voltage (v) @ i f = 350ma bin code min. max. g 2.75 3.00 color chromaticity coordinate @ i f = 350ma bin code min. max. august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 u3 109 118.5 v1 118.5 130 v2 130 140 v3 140 150 g 2.75 3.00 h 3.00 3.25 i 3.25 3.50 ref. 13 pages 14
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 7. labeling x 1 x 2 x 3 - x 4 x 5 - x 6 x 7 - x 8 x 9 full code form 1000 ############### sz5-p0-w0-00 sz5-p0-w0-00 x 10 x 11 x 12 x 13 - x 1 : company - x 2 x 3 : z-power led series number - x 4 : pkg series - x 5 : revision no. august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 - x 10 : luminous flux : lf [lm] -x 11 x 12 : color coordinates : x, y -x 13 : forward voltage : v f [v] rank x 10 x 11 x 12 x 13 lot no # 1 # 2 # 3 # 4 # 5 # 6 - # 7 # 8 # 9 # 10 - # 11 # 12 # 13 - # 1 # 2 : year - # 3 # 4 : month - # 5 # 6 : day - # 7 # 8 # 9 # 10 : mass order - # 11 # 12 # 13 : tray no. 15 - x 5 : revision no. - x 6 x 7 : color -x 8 x 9 : cri group
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 8. packing cathode mark cathode mark cathode mark cathode mark august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 (1) quantity : 1000pcs/reel (2) cumulative tolerance : cumulative tolerance/10 pitches to be 0.2mm (3) adhesion strength of cover tape : adhesion stre ngth to be 10-60g when the cover tape is turned off from the carrier tape at the angle of 10o to the carrier tape (4) package : p/n, manufacturing data code no. and quantity to be indicated on a damp proof package 13 22 16
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 8. packing reel packing structure aluminum vinyl bag reel this bag contains moisture sensitive devices caution level 2 1000 ############### x 10 x 11 x 12 x 13 1000 ############### sz5-p0-w0-00 sz5-p0-w0-00 x 10 x 11 x 12 x 13 august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 outer box size(mm) type 142 c 7inch 245 a 220 b *material: paper(sw3b(b)) acriche semiconductor ecolight a rohs b made in korea tuv c z led part : code : q' yt : lot no : date : ############### sz5-p0-w0-00 sz5-p0-w0-00 * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * 17
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet 9. recommended solder pad august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 notes : [1] all dimensions are in millimeters. [2] scale : none [3] this drawing without tolerances are for referen ce only [4] undefined tolerance is 0.1mm 18
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet ipc/jedec j-std-020 profile feature sn-pb eutectic assembly pb-free assembl y average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. 10. soldering august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 preheat - temperature min (tsmin) - temperature max (tsmax) - time (tsmin to tsmax) (ts) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: - temperature (tl) - time (tl) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature (tp) 215 260 time within 5 c of actual peak temperature (tp)2 10-30 seconds 20-40 seconds ramp-down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. * caution 1. reflow soldering is recommended not to be done more than two times. in the case of more than 24 hours passed soldering after first, leds will be damaged. 2. repairs should not be done after the leds have b een soldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds du ring heating. 5. after soldering, do not warp the circuit board. 19
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet (1) storage to avoid the moisture penetration, we recommend sto ring z5p series (z power) leds in a dry box with a desiccant . the recommended sto rage temperature range is 5 to 30 and a maximum humidity of rh50%. (2) use precaution after opening the packaging use proper smd techniques when the led is to be sol dered dipped as separation of the lens may affect the light output efficiency. pay attenti on to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 1 year (msl 2) or the color of the desiccant changes, components should be dried f or 10-12hr at 60 5 (3) do not apply mechanical force or excess vibrati on during the cooling process to normal temperature after soldering. (4) do not rapidly cool device after soldering. (5) components should not be mounted on warped (non coplanar) portion of pcb. (6) radioactive exposure is not considered for the products listed here in. 11. precaution for use august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 (6) radioactive exposure is not considered for the products listed here in. (7) gallium arsenide is used in some of the product s listed in this publication. these products are dangerous if they are burned or shredded in the pro cess of disposal. it is also dangerous to drink the liquid or inhale the gas generated by suc h products when chemically disposed of. (8) this device should not be used in any type of f luid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) s hould be used. (9) when the leds are in operation the maximum curre nt should be decided after measuring the package temperature. (10) leds must be stored properly to maintain the d evice. if the leds are stored for 3 months or more after being shipped from ssc, a sealed contain er with a nitrogen atmosphere should be used for storage. (11) the appearance and specifications of the produ ct may be modified for improvement without notice. (12) long time exposure of sunlight or occasional u v exposure will cause lens discoloration. 20
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet (13) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of led s and discolor when exposed to heat and photonic energy. the result can be a significant lo ss of light output from the fixture. knowledge of the properties of the materials select ed to be used in the construction of fixtures can help prevent these issues. (14) the slug is isolated from anode electrically. therefore, we recommend that you dont isolate the heat sink. (15) attaching leds, do not use adhesives that outg as organic vapor. (16) the driving circuit must be designed to allow forward voltage only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage. 11. precaution for use august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 21
apcpcwm_4828539:wp_0000001wp_0000001 apcpcwm_4828539:wp_0000001wp_0000001 z-power led x10490 z-power led x10490 technical data sheet (1) during processing, mechanical stress on the sur face should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (2) in general, leds should only be handled from th e side. by the way, this also applies to leds without a silicone sealant, since the surfa ce can also become scratched. (3) when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, ex cept that mechanical pressure on the surface of the resin must be prevented. this is assured by choosing a pick and place nozzle which is larger than the leds reflector area. 12. handling of silicone resin leds august 2012 august 2012 www.seoulsemicon.com www.seoulsemicon.com document no. : ssc- qp- 7- 07- 12 reflector area. (4) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the hand ling of such devices. compared to standard encapsulants, silicone is gene rally softer, and the surface is more likely to attract dust. as mentioned previously, the increased sensitivity to dust requires special care during processing. in cases where a minimal level o f dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) ssc suggests using isopropyl alcohol for cleani ng. in case other solvents are used, it must be assured that these solvents do not disso lve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (6) please do not mold this product into another re sin (epoxy, urethane, etc) and do not handle this product with acid or sulfur mate rial in sealed space. (7) avoid leaving fingerprints on silicone resin pa rts. 22

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